Ceramic electronic component

ABSTRACT

A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a ceramic electronic component.

2. Description of the Related Art

In recent years, ceramic electronic components typified by multilayerceramic capacitors have been used under more inhospitable environmentsthan ever before.

For example, electronic components for use in mobile devices such ascellular phones and portable music player are required to withstanddropping impacts. Specifically, the electronic components are requiredto keep from dropping from mounting boards and keep themselves frombeing cracked, when the electronic components are subjected to droppingimpacts.

Furthermore, electronic components for use in in-car devices such as anECU (Engine Control Unit) are required to withstand thermal cycleimpacts. Specifically, the electronic components are required to keepsolder used to mount the components and the components themselves frombeing cracked when the components are subjected to deflection stressgenerated by thermal expansion and contraction of the mounting boardsdue to thermal cycles.

In order to deal with these demands, Japanese Patent ApplicationLaid-Open No. 11-162771 discloses a multilayer ceramic capacitor whichincludes external electrodes obtained by sequentially stacking asintered electrode layer, a conductive resin layer including metalpowder, a Ni plated layer, and a Sn plated layer.

The sintered electrode layer (sintered metal layer) is formed by bakinga conductive paste applied to a laminated body. Shrinkage of a sinteredmetal powder included in the conductive paste concentrically generatesresidual stress on portions of the laminated body in contact with an endof the sintered metal layer. When the multilayer ceramic capacitormounted on a circuit board is subjected to an external force, acombination of residual stress and external stress may be concentricallyloaded on portions of the laminated body in contact with ends of thesintered metal layers of the external electrodes on the side opposed tothe circuit board, thereby resulting in crack generation.

While the multilayer ceramic capacitor disclosed in Japanese PatentApplication Laid-Open No. 11-162771 causes the epoxy-based thermosettingresin layer to absorb residual stress generated on the laminated bodyfor the purpose of suppressing crack generation, there is room to beable to further suppress crack generation by reducing residual stressgenerated on portions of the laminated body on which a combination ofresidual stress and external stress is concentrically loaded.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide a ceramicelectronic component and a manufacturing method therefor, which preventa laminated body from being cracked by reducing residual stressgenerated in portions of the laminated body on which a combination ofresidual stress and external stress is concentrically loaded.

A ceramic electronic component according to a preferred embodiment ofthe present invention includes a laminated body including a plurality ofceramic layers and a plurality of conductor layers that are stackedalternately; and first and second external electrodes provided onportions of the laminated body, and electrically connected to at leastsome conductor layers of the plurality of conductor layers. Thelaminated body includes a first end surface and a second end surfaceopposing each other in a length direction, a first principal surface anda second principal surface opposing each other in a height direction toconnect the first end surface and the second end surface, and a firstside surface and a second side surface opposing each other in a widthdirection to connect the first principal surface and the secondprincipal surface and connect the first end surface and the second endsurface. The height of the laminated body in the height direction islarger than the width of the laminated body in the width direction. Thefirst and second external electrodes each includes a sintered metallayer provided on the laminated body, a conductive resin layercontaining a mixture of a resin and a metal, which covers the sinteredmetal layer, and a plated layer which covers the conductive resin layer.The first external electrode extends from the first end surface to atleast a portion of the second principal surface, a portion of first sidesurface, and a portion of second side surface. The second externalelectrode extends from the second end surface to at least a portion ofthe second principal surface, a portion of first side surface, and aportion of second side surface. In the length direction, the maximumlength of the sintered metal layer provided on the second principalsurface is shorter than the maximum length of the sintered metal layerprovided on each of the first side surface and second side surface.

In a preferred embodiment of the present invention, the conductive resinlayer contains Cu or Ag.

In a preferred embodiment of the present invention, the sintered metallayer contains Cu.

In a preferred embodiment of the present invention, the plated layerincludes a Ni plated layer that covers the conductive resin layer, and aSn plated layer that covers the Ni plated layer.

In a preferred embodiment of the present invention, the maximum lengthof the sintered metal layer provided on the second principal surfacepreferably is shorter by about 20 μm or more, for example, than themaximum length of the sintered metal layer provided on each of the firstside surface and second side surface.

A method for manufacturing a ceramic electronic component according toanother preferred embodiment of the present invention includes the stepsof preparing a laminated body including a plurality of ceramic layersand a plurality of conductor layers that are stacked alternately; andproviding first and second external electrodes on portions of thelaminated body to be electrically connected to at least some conductorlayers of the plurality of conductor layers. The laminated body has afirst end surface and a second end surface opposing each other in alength direction, a first principal surface and a second principalsurface opposing each other in a height direction to connect the firstend surface and the second end surface, and a first side surface and asecond side surface opposing each other in a width direction to connectthe first principal surface and the second principal surface and connectthe first end surface and the second end surface. The height of thelaminated body in the height direction is larger than the width of thelaminated body in the width direction. The step of providing the firstand second external electrodes includes the steps of: applying aconductive paste from the first end surface to at least a portion of thesecond principal surface, a portion of the first side surface, and aportion of the second side surface; applying the conductive paste from aportion of the second end surface to at least a portion of the secondprincipal surface, a portion of the first side surface, and a portion ofthe second side surface; providing sintered metal layers by heating thelaminated body with the conductive paste applied to portions of thefirst end surface and the second end surface; applying a conductiveresin paste that is a mixture of a resin component and a metalcomponent, so as to cover the sintered metal layers; providing aconductive resin layer by heating the laminated body with the conductiveresin paste applied; and carrying out plating so as to cover theconductive resin layer. The method for manufacturing the ceramicelectronic component further includes, before the step of providing thefirst and second external electrodes, a step of forming a lipophobicfilm on only portions of the first principal surface and the secondprincipal surface, or on only a portion of the second principal surface.

In a preferred embodiment of the present invention, the conductive resinpaste contains Cu or Ag.

In a preferred embodiment of the present invention, the conductive pastecontains Cu.

In a preferred embodiment of the present invention, the plating stepincludes the steps of: carrying out Ni plating so as to cover theconductive resin layers, and carrying out Sn plating after the step ofcarrying out Ni plating.

According to various preferred embodiments of the present invention, thelaminated body is prevented from being cracked by reducing residualstress generated in portions of the laminated body on which acombination of residual stress and external stress is concentricallyloaded.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating the appearance of a ceramicelectronic component according to a preferred embodiment of the presentinvention.

FIG. 2 is a plan view of the ceramic electronic component as viewed froma direction of arrow II in FIG. 1.

FIG. 3 is a side view of the ceramic electronic component as viewed froma direction of arrow III in FIG. 1.

FIG. 4 is a cross-sectional view of the ceramic electronic component asviewed from an arrow direction of line IV-IV in FIG. 1.

FIG. 5 is a cross-sectional view of the ceramic electronic component asviewed from an arrow direction of line V-V in FIG. 1.

FIG. 6 is a cross-sectional view of the ceramic electronic component asviewed from an arrow direction of line VI-VI in FIG. 4.

FIG. 7 is a cross-sectional view of the ceramic electronic component asviewed from an arrow direction of line VII-VII in FIG. 4.

FIG. 8 is a flowchart showing a method for manufacturing a ceramicelectronic component according to a preferred embodiment of the presentinvention.

FIG. 9 is a perspective view of lipophobic films formed on only a firstprincipal surface and a second principal surface of a laminated body.

FIG. 10 is a side view illustrating a conductive paste being appliedaround a first end surface of a laminated body.

FIG. 11 is a side view illustrating the spread conductive paste appliedaround the first end surface.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Ceramic electronic components according to preferred embodiments of thepresent invention will be described below with reference to thedrawings.

In the following description of the preferred embodiments, the same orcorresponding elements in the figures will be denoted by the samereference numbers, and descriptions of the elements will not berepeated. While a ceramic capacitor will be described as the ceramicelectronic component in the following descriptions, the electroniccomponent is not limited to the capacitor, but encompasses apiezoelectric component, a thermistor, or an inductor.

FIG. 1 is a perspective view illustrating the appearance of a ceramicelectronic component according to a preferred embodiment of the presentinvention. FIG. 2 is a plan view of the ceramic electronic component asviewed from a direction of arrow II in FIG. 1. FIG. 3 is a side view ofthe ceramic electronic component as viewed from a direction of arrow IIIin FIG. 1. FIG. 4 is a cross-sectional view of the ceramic electroniccomponent as viewed from an arrow direction of line IV-IV in FIG. 1.FIG. 5 is a cross-sectional view of the ceramic electronic component asviewed from an arrow direction of line V-V in FIG. 1. FIG. 6 is across-sectional view of the ceramic electronic component as viewed froman arrow direction of line VI-VI in FIG. 4. FIG. 7 is a cross-sectionalview of the ceramic electronic component as viewed from an arrowdirection of line VII-VII in FIG. 4. In FIG. 1, the length direction ofthe laminated body described below is denoted by L, the width directionof the laminated body is denoted by W, and the height direction of thelaminated body is denoted by T.

As shown in FIGS. 1 to 7, a ceramic electronic component 100 accordingto a preferred embodiment of the present invention includes a cuboidallaminated body 110 including a plurality of ceramic layers (dielectriclayers) 150 stacked and a plurality of conductor layers 140, and a pairof external electrodes provided on both ends of the laminated body 110.

In the present preferred embodiment, the direction of stacking theplurality of dielectric layers 150 and the plurality of conductor layers140 is orthogonal to the length direction L of the laminated body 110and the width direction W of the laminated body 110. More specifically,the direction of stacking the plurality of dielectric layers 150 and theplurality of conductor layers 140 is parallel to the height direction Tof the laminated body 110. However, the direction of stacking theplurality of dielectric layers 150 and the plurality of conductor layers140 may be parallel to the width direction W of the laminated body 110.

The laminated body 110 includes a first end surface 113 and a second endsurface 114 located on the opposite side of the laminated body 110 fromeach other, a first principal surface 111 and a second principal surface112 located on the opposite side of the laminated body 110 from eachother to connect the first end surface 113 and the second end surface114, and a first side surface 115 and a second side surface 116 locatedon the opposite side of the laminated body 110 from each other toconnect the first principal surface 111 and the second principal surface112 and connect the first end surface 113 and the second end surface114. The second principal surface 112 is a surface that is opposed to acircuit board when the ceramic electronic component 100 is mounted onthe circuit board.

The height T₁ of the laminated body 110 in the direction of connectingthe first principal surface 111 and the second principal surface 112 atthe shortest distance (the height direction T of the laminated body 110)is larger than the width W₁ of the laminated body 110 in the directionof connecting the first side surface 115 and the second side surface 116at the shortest distance (the width direction W of the laminated body110). The width W₁ of the laminated body 110 is smaller than the lengthof the laminated body 110.

The laminated body 110 preferably has a cuboidal outline, but may haveat least one of corners and ridges rounded. In addition, any of thefirst and second principal surfaces 111, 112, the first and second endsurfaces 113, 114, and the first and second side surfaces 115, 116 maycontain asperities.

The laminated body 110 preferably includes an inner layer portion 110 mincluding the layers from the conductor layer 140 located closest to thefirst principal surface 111 among the plurality of conductor layers 140to the conductor layer 140 located closest to the second principalsurface 112 among the plurality of the conductor layers 140, in thedirection of stacking the laminated body 110; and a first outer layerportion 150 a and a second outer layer portion 150 b that sandwich theinner layer portion 110 m therebetween.

In the inner layer portion 110 m, some dielectric layers 150 of theplurality of dielectric layers 150 and all of the conductor layers 140are stacked in such a way that the dielectric layers 150 and theconductor layers 140 are alternately stacked. More specifically, theinner layer portion 110 m includes all of the conductor layers 140. Allof the conductor layers 140 are each preferably rectangular orsubstantially rectangular in planar view.

The first outer layer portion 150 a includes the dielectric layer 150located closest to the first principal surface 111 among the pluralityof dielectric layers 150. The second outer layer portion 150 b includesthe dielectric layer 150 located closest to the second principal surface112 among the plurality of dielectric layers 150.

One of the pair of external electrodes is a first external electrode 120provided on one end of the laminated body 110 in the length direction L,whereas the other of the pair of external electrodes is a secondexternal electrode 130 provided on the other end of the laminated body110 in the length direction L.

Specifically, the first external electrode 120 is provided on the firstend surface 113 of the laminated body 110, whereas the second externalelectrode 130 is provided on the second end surface 114 of the laminatedbody 110. In the present preferred embodiment, the first externalelectrode 120 extends from the first end surface 113 to at least aportion of the first principal surface 111, a portion of the secondprincipal surface 112, a portion of the first side surface 115, and aportion of the second side surface 116. The second external electrode130 extends from the second end surface 114 to at least a portion of thefirst principal surface 111, a portion of second principal surface 112,a portion of first side surface 115, and a portion of second sidesurface 116.

However, the location of the pair of external electrodes is not limitedto the foregoing, but what is preferred is that the first externalelectrode 120 extends from the first end surface 113 to at least aportion of the second principal surface 112, a portion of the first sidesurface 115, and a portion of the second side surface 116, whereas thesecond external electrode 130 extends from the second end surface 114 toat least a portion of the second principal surface 112, a portion of thefirst side surface 115, and a portion of the second side surface 116.

The first conductor layer 141 of the conductor layers 140 adjacentlyopposed to each other is electrically connected to the first externalelectrode 120 at the first end surface 113, whereas the second conductorlayer 142 is electrically connected to the second external electrode 130at the second end surface 114.

While all of the conductor layers 140 preferably are electricallyconnected to the first external electrode 120 or the second externalelectrode 130 in the present preferred embodiment, the present inventionis not limited to this preferred embodiment, but what is needed is thatat least some conductor layers 140 of the plurality of conductor layers140 are electrically connected to the pair of external electrodes. Morespecifically, the plurality of conductor layers 140 may includeconductor layers 140 that are not electrically connected to the pair ofexternal electrodes.

The ceramic electronic component 100 has external dimensions of: lengthL₀; width W₀; and height T₀ that are defined by the pair of externalelectrodes.

The respective elements will be described below in detail.

Dielectric ceramics containing BaTiO₃, CaTiO₃, SrTiO₃, CaZrO₃, or thelike as a main constituent can be used as a material constituting thedielectric layers 150. In addition, materials may be used which areobtained by adding, to any of the main constituents, a Mn compound, a Fecompound, a Cr compound, a Co compound, a Ni compound, or the like as anaccessory constituent.

It is to be noted that when the electronic component is a piezoelectriccomponent, the dielectric layers 150 can be composed of a piezoelectricceramic. Examples of the piezoelectric ceramic include, for example, aPZT (lead zirconate titanate) based ceramic.

When the electronic component is a thermistor, the dielectric layers 150can be composed of a semiconductor ceramic. Examples of thesemiconductor ceramic include, for example, a spinel-based ceramic.

When the electronic component is an inductor, the dielectric layers 150can be composed of a magnetic ceramic. Examples of the magnetic ceramicinclude, for example, a ferrite ceramic.

The thickness of each dielectric layer 150 included in the inner layerportion 110 m is preferably about 0.5 μm or more and about 10 μm orless, for example. The height of the second outer layer portion 150 b ispreferably larger than the height of the first outer layer portion 150a. In this case, if a crack is generated from the second principalsurface 112 of the laminated body 110, the crack is prevented fromreaching the inner layer portion 110 m. The height of the second outerlayer portion 150 b is preferably about 30 μm or more, for example.

In addition, the second outer layer portion 150 b may include an outsideouter layer portion including the dielectric layer 150 located closestto the second principal surface 112 among the plurality of dielectriclayers 150, and an inside outer layer portion including the dielectriclayer 150 located adjacent to a surface of the outside outer layerportion closer to the first principal surface 111. The height of theinside outer layer portion may be equal to or less than the height ofthe first outer layer portion 150 a.

The constituent contained in the dielectric layer constituting theoutside outer layer portion preferably includes more Si, as comparedwith the constituent contained in the dielectric layer constituting theinside outer layer portion. In addition, the height of the outside outerlayer portion is preferably larger than the height of the inside outerlayer portion. In this case, because the dielectric layer with a higherSi content ratio has a higher heat shrinkage ratio in firing, the heatshrinkage ratio in firing becomes higher in the outside outer layerportion than in the inside outer layer portion. As a result, the heatshrinkage ratio of the outside outer layer portion is closer to the heatshrinkage ratio of the conductor layers 140 in the inner layer portion110 m.

Therefore, because internal stress that acts on the boundary between theinner layer portion 110 m and the second outer layer portion 150 b isrelaxed due to a difference in heat shrinkage ratio between thedielectric layer 150 and the conductor layer 140 in firing, a crack(delamination) is prevented from being generated at the boundary betweenthe inner layer portion 110 m and the second outer layer portion 150 b.

Furthermore, the Si content ratio is preferably higher at the boundaryportion between the outside outer layer portion and the inside outerlayer portion, as compared with a central portion of the outside outerlayer portion. In this case, when the laminated body 110 is subjected tofiring, Si segregated from grain boundaries of ceramic grains can fill alarge number of minute gaps present at the interface between the outsideouter layer portion and the inside outer layer portion to improve theadhesion between the outside outer layer portion and the inside outerlayer portion. As a result, if a crack is generated from the secondprincipal surface 112 of the laminated body 110, the crack is preventedfrom reaching the inner layer portion 110 m by preventing crackdevelopment or changing the direction of crack development at theboundary portion of the outside outer layer portion with the insideouter layer portion.

The first conductor layers 141 and the second conductor layers 142 arealternately arranged at regular intervals in the height direction T ofthe laminated body 110. The first conductor layers 141 and the secondconductor layers 142 are each preferably about 0.2 μm or more and about2.0 μm or less in thickness, for example.

The first conductor layers 141 extend from the first end surface 113toward the second end surface 114.

The second conductor layers 142 extend from the second end surface 114toward the first end surface 113.

Metals such as Ni, Cu, Ag, Pd, and Au, or alloys containing at least oneof the metals, for example, an alloy of Ag and Pd can be used as thematerial constituting the conductor layer 140.

The first external electrode 120 preferably includes a first sinteredmetal layer 121 provided on the laminated body 110; a first conductiveresin layer 122 including a mixture of a resin component and a metalcomponent, which covers the first sintered metal layer 121; and a firstplated layer 123 which covers the first conductive resin layer 122.

The second external electrode 130 includes a second sintered metal layer131 provided on the laminated body 110; a second conductive resin layer132 including a mixture of a resin component and a metal component,which covers the second sintered metal layer 131; and a second platedlayer 133 which covers the second conductive resin layer 132.

The first sintered metal layer 121 extends from the first end surface113 to respective portions of the first principal surface 111, secondprincipal surface 112, first side surface 115, and second side surface116. The second sintered metal layer 131 extends from the second endsurface 114 to respective portions of the first principal surface 111,second principal surface 112, first side surface 115, and second sidesurface 116. The first and second sintered metal layers 121, 131 areeach preferably about 10.0 μm or more and about 50.0 μm or less inthickness, for example.

In the direction connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length La of the first sintered metallayer 121 provided on the second principal surface 112 is shorter thanthe maximum length Ld of the first sintered metal layer 121 provided oneach of the first side surface 115 and second side surface 116.

Preferably, in the direction connecting the first end surface 113 andthe second end surface 114 at the shortest distance (the lengthdirection L of the laminated body 110), the maximum length La of thefirst sintered metal layer 121 provided on the second principal surface112 is shorter by about 20 μm or more, for example, than the maximumlength Ld of the first sintered metal layer 121 provided on each of thefirst side surface 115 and second side surface 116.

In the direction connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length Lb of the second sintered metallayer 131 provided on the second principal surface 112 is shorter thanthe maximum length Le of the second sintered metal layer 131 provided oneach of the first side surface 115 and the second side surface 116.

Preferably, in the direction connecting the first end surface 113 andthe second end surface 114 at the shortest distance (the lengthdirection L of the laminated body 110), the maximum length Lb of thesecond sintered metal layer 131 provided on the second principal surface112 is shorter by about 20 μm or more, for example, than the maximumlength Le of the second sintered metal layer 131 provided on each of thefirst side surface 115 and the second side surface 116.

The maximum length La of the first sintered metal layer 121 and themaximum length Lb of the second sintered metal layer 131 are eachpreferably about 5 μm or more and about 110 μm or less, for example. Themaximum length Ld of the first sintered metal layer 121 and the maximumlength Le of the second sintered metal layer 131 are each preferablyabout 25 μm or more and about 145 μm or less, for example.

The first and second sintered metal layers 121, 131 each contain a metalcomponent and a glass component. Metals such as Ni, Cu, Ag, Pd, and Au,or alloys containing at least one of the metals, for example, an alloyof Ag and Pd can be used as the metal component. Glass containing B, Si,Ba, Mg, Al, Li, or the like can be used as the glass component.

The first conductive resin layer 122 covers the entire outer surface ofthe first sintered metal layer 121. The second conductive resin layer132 covers the entire outer surface of the second sintered metal layer131. The first and second conductive resin layers 122, 132 are eachpreferably about 10.0 μm or more and about 150.0 μm or less inthickness, for example.

In the direction connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length of the first conductive resinlayer 122 provided over the second principal surface 112 is shorter thanthe maximum length of the first conductive resin layer 122 provided overeach of the first side surface 115 and the second side surface 116.

In the direction connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length of the second conductive resinlayer 132 provided over the second principal surface 112 is shorter thanthe maximum length of the second conductive resin layer 132 providedover each of the first side surface 115 and the second side surface 116.

Metals such as Cu, Ag, and Ni, or alloys containing at least one of themetals can be used as the metal component contained in each of the firstand second conductive resin layers 122, 132.

Various known thermosetting resins such as epoxy resins, phenolicresins, urethane resins, silicon resins, and polyimide resins can beused as the resin component contained in each of the first and secondconductive resin layers 122, 132. Among these resins, the epoxy resinswhich have excellent heat resistance, moisture resistance, and adhesion,etc. are preferably used.

In addition, the first and second conductive resin layers 122, 132 eachpreferably contain a curing agent along with the thermosetting resin. Inthe case of using an epoxy resin as a base resin, various curing agentscan be used such as phenols, amines, acid anhydrides, or imidazoles.

The first and second conductive resin layers 122, 132 each contain theresin component and define and function as a buffer layer. Morespecifically, when a physical impact or a shock caused by a thermalcycle is applied to the ceramic electronic component 100, the resincomponents of the respective first and second conductive resin layers122, 132 absorb the impact or shock. As a result, a solder used to mountthe electronic component 100 and the ceramic electronic component 100itself can be kept from being cracked.

The first plated layer 123 covers the entire outer surface of the firstconductive resin layer 122. The second plated layer 133 covers theentire outer surface of the second conductive resin layer 132.

In the direction connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length of the first plated layer 123provided over the second principal surface 112 is shorter than themaximum length of the first plated layer 123 provided over each of thefirst side surface 115 and the second side surface 116.

In the direction connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length of the second plated layer 133provided over the second principal surface 112 is shorter than themaximum length of the second plated layer 133 provided over each of thefirst side surface 115 and the second side surface 116.

Metals such as Ni, Cu, Ag, Pd, and Au, or alloys containing at least oneof the metals, for example, an alloy of Ag and Pd can be used as thematerial constituting each of the first and second plated layers 123,133.

In the present preferred embodiment, the first plated layer 123 includesa first Ni plated layer 124 that covers the first conductive resin layer122, and a first Sn plated layer 125 that covers the first Ni platedlayer 124.

The second plated layer 133 includes a second Ni plated layer 134 thatcovers the second conductive resin layer 132, and a second Sn platedlayer 135 that covers the second Ni plated layer 134.

The first and second Ni plated layers 124, 134 define and function assolder barrier layers. The first and second Sn plated layers 125, 135make a solder likely to wet the surface of the pair of externalelectrodes upward in mounting of the ceramic electronic component. Thethickness per plated layer is preferably about 1.0 μm or more and about10.0 μm or less, for example.

A non-limiting example of a method for manufacturing a ceramicelectronic component according to a preferred embodiment of the presentinvention will be described below with reference to the drawings. FIG. 8is a flowchart showing a method for manufacturing a ceramic electroniccomponent according to a preferred embodiment of the present invention.

As shown in FIG. 8, a cuboidal laminated body 110 is prepared whichincludes a plurality of dielectric layers 150 stacked and a plurality ofconductor layers 140 stacked (S10). The laminated body 110 is preparedas follows.

First, a ceramic paste including a ceramic powder is applied in the formof a sheet by a screen printing method or the like, and dried to prepareceramic green sheets.

As for some of the plurality of ceramic green sheets prepared, aconductive paste for the formation of internal electrodes is applied bya screen printing method onto the ceramic green sheets so as to providepredetermined patterns. In this way, prepared are the ceramic greensheets with conductive patterns formed for serving as internalelectrodes and the ceramic green sheets with no conductive patternsformed. It is to be noted that the conductive paste for the formation ofinternal electrodes and the ceramic paste may include a known binder anda solvent.

A mother laminated body is prepared by stacking a predetermined numberof sheets among the ceramic green sheets with no conductive patternsformed, stacking thereon a plurality of ceramic green sheets with theconductive patterns formed, and further stacking a predetermined numberof sheets among the ceramic green sheets with no conductive patternsformed. If necessary, the mother laminated body may be pressed in thestacking direction in a way such as isostatic press.

The mother laminated body is cut into a predetermined shape and dividedto prepare a plurality of cuboidal soft laminated bodies. It is to benoted that the cuboidal soft laminated bodies may subjected to barrelfinishing to round corners of the soft laminated bodies.

The soft laminated body is hardened by firing to prepare the laminatedbody 110. The firing temperature is appropriately set depending on thetypes of the ceramic material and conductive material, and set withinthe range of, for example, 900° C. or higher and 1300° C. or lower.

Next, a lipophobic film is formed on only a portion of the firstprincipal surface 111 and a portion of the second principal surface 112of the laminated body 110, or on only a portion of the second principalsurface 112 (S11). The surface of the laminated body 110 is preferablycleaned before forming the lipophobic film.

The lipophobic film includes a deposited film of fluorine-containingpolymer deposited on the surface of the laminated body 110 by turning agas containing C and F into plasma, a baked film offluorocarbon-containing polymer, a chemically adsorbed monomolecularfilm containing fluorine, which is formed with a siloxane linkage, anapplied film of fluorine-containing resin, an applied film ofsilicon-containing resin, or the like.

In the case of composing the lipophobic film of a deposited film offluorine-containing polymer, fluorocarbon (CxFy: y/x≦2.5 met) ispreferably used as a raw material gas containing a lipophobic material.When this fluorocarbon is used, a monomer containing CF and CF₂ as itsmain constituent is produced by plasma treatment. The lipophobic film isformed on the surface of the laminated body 110 by depositing a coatingagent containing CF and CF₂ as monomers on the surface of the laminatedbody 110. The lipophobic film prevents a conductive paste describedbelow from spreading out on the surface of the laminated body 110.

FIG. 9 is a perspective view of lipophobic films formed on only aportion of a first principal surface and a portion of a second principalsurface of a laminated body. As shown in FIG. 9, a lipophobic film 190extends from a position at a distance of length Lx from the first endsurface 113, to a position at a distance of length Lx from the secondend surface, on each of the first principal surface 111 and the secondprincipal surface 112 of the laminated body 110 in the present preferredembodiment. The length Lx is slightly shorter than the maximum length Laof the first sintered metal layer 121 and the maximum length Lb of thesecond sintered metal layer 131.

However, the lipophobic films 190 may be formed entirely over the firstprincipal surface 111 and the second principal surface 112 of thelaminated body 110. In this case, lipophobic films 190 that haverelatively low performance in preventing the conductive paste fromspreading out are formed entirely over the first principal surface 111and the second principal surface 112. Alternatively, the lipophobic film190 may be formed on only the second principal surface 112.

Next, a pair of external electrodes is provided on both ends of thelaminated body 110 so as to be electrically connected to at least someconductor layers 140 of the plurality of conductor layers 140 (S20).

First, the conductive paste is applied to both ends of the laminatedbody 110 with the lipophobic films formed, and baked (S21). Theconductive paste includes a metal component and a glass component.Metals such as Ni, Cu, Ag, Pd, and Au, or alloys containing at least oneof the metals, for example, an alloy of Ag and Pd can be used as themetal component. Glass containing B, Si, Ba, Mg, Al, Li, or the like canbe used as the glass component.

FIG. 10 is a side view illustrating a conductive paste being appliedaround a first end surface of a laminated body. FIG. 11 is a side viewillustrating the spread conductive paste applied around the first endsurface.

As shown in FIG. 10, the first end surface 113 of the laminated body 110with the lipophobic films 190 formed on only the first principal surfaceand the second principal surface is immersed in a conductive paste 91put in a container 90. Specifically, the laminated body 110 is immersedin the conductive paste 91 until an end of the lipophobic film 190closer to the first end surface 113 comes into contact with theconductive paste 91. Thus, the conductive paste is applied over from thefirst end surface 113 of the laminated body 110 to the first principalsurface 111, second principal surface 112, first side surface 115, andsecond side surface 116 thereof.

The lipophobic films 190 prevent the conductive paste 91 from spreadingout on the surface of the laminated body 110. Therefore, the conductivepaste 91 applied to the first and second principal surfaces 111, 112hardly spreads out on the lipophobic films 190.

When the laminated body 110 is pulled up from the inside of thecontainer 90, the conductive paste 91 is applied around the first endsurface 113 of the laminated body 110 as shown in FIG. 11. Theconductive paste 91 applied to the first and second side surfaces 115,116 spreads out to the second end surface, whereas the conductive paste91 applied to the first and second principal surfaces 111, 112 hardlyspreads out to the second end surface.

As a result, in the direction connecting the first end surface 113 andthe second end surface 114 at the shortest distance (the lengthdirection L of the laminated body 110), the maximum length La of thefirst sintered metal layer 121 provided on each of the first principalsurface 111 and second principal surface 112 is shorter than the maximumlength Ld of the second sintered metal layer 131 provided on each of thefirst side surface 115 and the second side surface 116.

Likewise, the second sintered metal layer 131 is provided around thesecond end surface 114 of the laminated body 110. As a result, in thedirection connecting the first end surface 113 and the second endsurface 114 at the shortest distance (the length direction L of thelaminated body 110), the maximum length Lb of the second sintered metallayer 131 provided on each of the first principal surface 111 and thesecond principal surface 112 is shorter than the maximum length Le ofthe second sintered metal layer 131 provided on each of the first sidesurface 115 and the second side surface 116.

The metal component included in the conductive paste 91 is subjected tosintering by heating the laminated body 110 with the conductive paste 91applied thereto. The heating temperature is preferably 700° C. or higherand 900° C. or lower, for example. It is to be noted that the lipophobicfilms 190 disappear in baking the conductive paste 91. Thus, it becomespossible to apply a conductive resin paste described below to thelaminated body 110.

While the conductive paste 91 applied to both ends of the firedlaminated body 110 preferably is baked to provide the first and secondsintered metal layers 121, 131 in the present preferred embodiment, theconductive paste 91 applied to the both ends of the unfired softlaminated body may be subjected to co-firing with the conductor layers140 to provide the first and second sintered metal layers 121, 131.

Next, the conductive resin paste is applied to both ends of thelaminated body 110 with the first and second sintered metal layers 121,131 provided, and subjected to thermal curing (S22). First, prepared area thermosetting resin as a resin component, and the conductive resinpaste which is a mixture including a conductive filler as a metalcomponent.

Metal particles such as Cu or Ag, or metal particles such as Cu or Niwith surfaces coated with Ag can be used as the conductive filler. Themetal particles of Cu may be subjected to antioxidant treatment.

The average particle size of the conductive filler is not particularlylimited, but may be, for example, about 1.0 μm or more and about 10.0 μmor less. It is to be noted that the average particle size of theconductive filler refers to a particle size corresponding to about 50%of an integrated value in a particle size distribution obtained by alaser diffraction-scattering method.

The conductive filler provides conductivity for each of the first andsecond conductive resin layers 122, 132. Specifically, the conductivefiller comes into contact with one another to define electricallyconducting paths within each of the first and second conductive resinlayers 122, 132.

The shape of the conductive filler is not particularly limited, but maybe spherical or flattened. It is to be noted that the flattened shape ofthe conductive filler indicates that the outline of the conductivefiller has an aspect ratio of 5:1 or more, for example. The shape of theconductive filler can be confirmed by observing the first and secondconductive resin layers 122, 132 with the use of SEM (Scanning ElectronMicroscope) in a cross section LT exposed in such a way that the ceramicelectronic component 100 subjected to surface treatment so as not toproduce polishing shear drop or the like is polished to a centralportion in the width direction W in parallel with the first side surface115 or the second side surface 116.

As the conductive filler, a spherical conductive filler and a flattenedconductive filler are preferably used in mixture. In this case, theratio between the particle number of the spherical conductive filler andthe particle number of the flattened conductive filler preferably fallswithin the range of 3:7 to 7:3, for example.

When the ratio between the particle number of the spherical conductivefiller and the particle number of the flattened conductive filler ishigher than 7:3, electrical connection is ensured within each of thefirst and second conductive resin layers 122, 132, while the first andsecond conductive resin layers 122, 132 come to fail to function asbuffer layers because of the excessively small amount of the flattenedconductive filler.

When the ratio between the particle number of the spherical conductivefiller and the particle number of the flattened conductive filler islower than 3:7, electrical connection can be insufficiently ensuredwithin each of the first and second conductive resin layers 122, 132because of the excessively small amount of the spherical conductivefiller, and the electrical conductivity of the pair of externalelectrodes is decreased to increase the equivalent series resistance(ESR: Equivalent Series Resistance) of the ceramic electronic component100.

Various known thermosetting resins such as epoxy resins, phenolicresins, urethane resins, silicon resins, and polyimide resins can beused as the thermosetting resin. Among these resins, the epoxy resinsare preferably used which have excellent heat resistance, moistureresistance, and adhesion, etc.

The conductive resin paste preferably contains a curing agent along withthe thermosetting resin.

In the case of using an epoxy resin as a base resin, various curingagents can be used such as phenols, amines, acid anhydrides, orimidazoles.

The conductive resin paste is applied by various printing methods, dipmethods, or the like so as to cover each of the first and secondsintered metal layers 121, 131, and the laminated body 110 with theconductive resin paste applied is heated to cure the thermosettingresin.

The laminated body 110 with the conductive resin paste applied ispreferably subjected to heating treatment in a neutral atmosphere suchas a nitrogen gas atmosphere or other non-oxidizing atmosphere such as areducing atmosphere.

Specifically, the laminated body 110 with the conductive resin pasteapplied is preferably heated under an atmosphere with an oxygenconcentration of about 100 ppm or less, for example. The heatingtemperature is preferably 150° C. or higher and 300° C. or lower, forexample.

In accordance with the step described above, the laminated body 110 isprovided with the first and second conductive resin layers 122, 132.

Next, the laminated body 110 with the first and second conductive resinlayers 122, 132 provided is subjected to Ni plating by an electrolyticplating method or the like (S23). Thus, first and second Ni platedlayers 124, 134 are provided which respectively cover the first andsecond conductive resin layers 122, 132.

Furthermore, the laminated body 110 with the first and second Ni platedlayers 124, 134 provided is subjected to Sn plating by an electrolyticplating method (S24). Thus, first and second Sn plated layers 125, 135are provided which respectively cover the first and second Ni platedlayers 124, 134.

Through the series of steps described above, the ceramic electroniccomponent 100 which has the structure shown in FIGS. 1 to 7 ismanufactured.

In the ceramic electronic component 100 according to the presentpreferred embodiment, in the direction connecting the first end surface113 and the second end surface 114 at the shortest distance (the lengthdirection L of the laminated body 110), the maximum length La of thefirst sintered metal layer 121 provided on the second principal surface112 is shorter than the maximum length Ld of the first sintered metallayer 121 provided on each of the first side surface 115 and the secondside surface 116. In addition, in the direction connecting the first endsurface 113 and the second end surface 114 at the shortest distance (thelength direction L of the laminated body 110), the maximum length Lb ofthe second sintered metal layer 131 provided on the second principalsurface 112 is shorter than the maximum length Le of the second sinteredmetal layer 131 provided on each of the first side surface 115 and thesecond side surface 116.

As described above, when the ceramic electronic component 100 mounted ona circuit board is subjected to an external force, a combination ofresidual stress and external stress is concentrically loaded on portionsof the laminated body 110 in contact with respective ends of the firstand second sintered metal layers 121, 131 on the second principalsurface 112 opposed to the circuit board.

Shrinkage stress that acts on portions of the laminated body 110 incontact with respective ends of the first and second sintered metallayers 121, 131 on the second principal surface 112 in baking theconductive paste can be reduced by making the maximum length La of thefirst sintered metal layer 121 provided on the second principal surface112 shorter than the maximum length Ld of the first sintered metal layer121 provided on each of the first side surface 115 and the second sidesurface 116, and making the maximum length Lb of the second sinteredmetal layer 131 provided on the second principal surface 112 shorterthan the maximum length Le of the second sintered metal layer 131provided on each of the first side surface 115 and second side surface116. As a result, residual stress generated on portions of the laminatedbody 110 in contact with respective ends of the first and secondsintered metal layers 121, 131 on the second principal surface 112 issignificantly reduced or prevented.

Furthermore, in the ceramic electronic component 100 according to thepresent preferred embodiment, the height T₁ of the laminated body 110 islarger than the width W₁ of the laminated body 110. Therefore, the areaof contact between the first and second sintered metal layers 121, 131and the second principal surface 112 are smaller than the areas ofcontact between the first and second sintered metal layers 121, 131 andeach of the first side surface 115 and the second side surface 116.

Thus, the shrinkage force which acts on the second principal surface 112of the laminated body 110 in baking the conductive paste is smaller thanthe shrinkage force which acts on each of the first side surface 115 andthe second side surface 116 of the laminated body 110 in baking theconductive paste.

As a result, cracks are prevented from being generated from portions ofthe laminated body 110 in contact with respective ends of the first andsecond sintered metal layers 121, 131 on the second principal surface112.

In addition, when the ceramic electronic component 100 is mounted on acircuit board, the area of contact between the first and the secondplated layers 123, 133 and a solder can be made larger at the first sidesurface 115 and the second side surface 116 than at the second principalsurface 112. Thus, the joining force of a solder on the pair of externalelectrodes, which spreads upward on each of the first side surface 115and second side surface 116, maintain the fixing strength between theceramic electronic component 100 and the circuit board.

As described above, the maximum length La of the first sintered metallayer 121 and the maximum length Lb of the second sintered metal layer131 are each preferably about 5 μm or more and about 110 μm or less, forexample.

When the maximum length La of the first sintered metal layer 121 and themaximum length Lb of the second sintered metal layer 131 are eachshorter than about 5 μm, the distance along the outer surface of thelaminated body 110 between an end of the first sintered metal layer 121and the first conductor layers 141 located at the first end surface 113,and the distance along the outer surface of the laminated body 110between an end of the second sintered metal layer 131 and the secondconductor layers 142 at the second end surface 114 each becomeexcessively short, thereby resulting in insufficient moistureresistance. In this case, there is a possibility that moisture ingressfrom the outside will short-circuit the ceramic electronic component100.

When the maximum length La of the first sintered metal layer 121 and themaximum length Lb of the second sintered metal layer 131 are each longerthan about 110 μm, shrinkage stress can be insufficiently reduced whichacts on portions of the laminated body 110 in contact with respectiveends of the first and second sintered metal layers 121, 131 on thesecond principal surface 112 in baking the conductive paste.

As described above, the maximum length Ld of the first sintered metallayer 121 and the maximum length Le of the second sintered metal layer131 are each preferably about 25 μm or more and about 145 μm or less,for example. When the maximum length Ld of the first sintered metallayer 121 and the maximum length Le of the second sintered metal layer131 are each larger than about 145 μm, there is a possibility thatresidual stress generated on portions of the laminated body 110 incontact with respective ends of the first and second sintered metallayers 121, 131 at the first side surface 115 and the second sidesurface 116 will be increased to generate cracks.

Experimental examples will be described below for evaluating theinfluences of the relationships between the maximum lengths La, Lb andmaximum lengths Ld, Le of the first and second sintered metal layers121, 131 on crack generation in the ceramic electronic component and thefixing strength between the ceramic electronic component and the circuitboard.

EXPERIMENTAL EXAMPLES

In the experimental examples, prepared were three types of ceramicelectronic components according to Comparative Examples 1 and 2 andExample 1. First, conditions (designed values) common to the three typesof ceramic electronic components will be described.

The external dimensions of the ceramic electronic components wereadjusted to 1.1 mm in length L₀, 0.6 mm in width W₀, and 0.9 mm inthickness T₀. The first outer layer portion and the second outer layerportion were each adjusted to 40 μm in thickness. The thickness of thesintered metal layer was adjusted to 5 μm on the first and secondprincipal surfaces 111, 112 and on the first and second side surfaces115, 116, and to 10 μm on the first and second end surfaces 113, 114.The thickness of the conductive resin layer was adjusted to 10 μm on thefirst and second principal surfaces 111, 112 and on the first and secondside surfaces 115, 116, and to 20 μm on the first and second endsurfaces 113, 114. The thickness of the plated layer of the Ni platedlayer and Sn plated layer combined was adjusted to 10 μm on the firstand second principal surfaces 111, 112 and on the first and second sidesurfaces 115, 116, and to 7 μm on the first and second end surfaces 113,114.

In the case of the ceramic electronic component according to Example 1,lipophobic films 190 of silicon-based resin were formed from a positionat a distance of length Lx from the first end surface 113, to a positionat a distance of length Lx from the second end surface, on only each ofthe first and second principal surfaces 111, 112 as shown in FIG. 9.

The maximum lengths La, Lb of the first and second sintered metal layers121, 131 were adjusted to 90 μm, and the maximum lengths Ld, Le thereofwere adjusted to 110 μm.

In the case of the ceramic electronic component according to ComparativeExample 1, no lipophobic film 190 was formed on any surface of thelaminated body 110. The maximum lengths La, Lb of the first and secondsintered metal layers 121, 131 were adjusted to 110 μm, and the maximumlengths Ld, Le thereof were adjusted to 110 μm.

In the case of the ceramic electronic component according to ComparativeExample 2, lipophobic films 190 of silicon-based resin were formed froma position at a distance of length Lx from the first end surface 113, toa position at a distance of length Lx from the second end surface, ononly each of the first and second side surfaces 115, 116. The maximumlengths La, Lb of the first and second sintered metal layers 121, 131were adjusted to 110 μm, and the maximum lengths Ld, Le thereof wereadjusted to 90 μm.

As shown in FIG. 2, each of the first and second sintered metal layers121, 131 located on the first and second principal surfaces 111, 112typically has a maximum length in a cross section LT including a centralaxis Lc of the laminated body 110. Therefore, the maximum length La, Lbof the first or second sintered metal layers 121, 131 are obtained bypolishing the ceramic electronic component to expose a cross section LTpassing through the central axis Lc of the laminated body 110, andobserving the exposed cross section with an optical microscope tomeasure the length of the longest point of the first or second sinteredmetal layer 121, 131.

As shown in FIG. 3, each of the first and second sintered metal layers121, 131 located on the first and second side surfaces 115, 116typically has a maximum length in a cross section LW including thecentral axis Lc of the laminated body 110. Therefore, the maximum lengthLd, Le of the first or second sintered metal layers 121, 131 areobtained by polishing the ceramic electronic component to expose a crosssection LW passing through the central axis Lc of the laminated body110, and observing the exposed cross section with an optical microscopeto measure the length of the longest point of the first or secondsintered metal layer 121, 131.

In the evaluation of crack generation in the ceramic electroniccomponents, twenty pieces were prepared for each of the three types ofceramic electronic components, and the ceramic electronic componentswere evaluated as bad if there was any ceramic electronic component witha crack found to reach the conductor layer among the twenty pieces, asno good if there was any ceramic electronic component with a crack foundto be generated among the twenty pieces while no crack was found toreach the conductor layer, or as good if the twenty pieces of ceramicelectronic components were all found to generate no crack.

In the evaluation of crack generation in the ceramic electroniccomponents, each of the three types of ceramic electronic componentsaccording to Comparative Examples 1 and 2 and Example 1 was mounted on aglass epoxy substrate, and the ceramic electronic components mountedwere sealed with a resin. Each of the three types of ceramic electroniccomponents according to Comparative Examples 1 and 2 and Example 1 wasmounted so that the second principal surface 112 was opposed to theglass epoxy substrate, and the push amount of a suction nozzle of themount machine was adjusted to 1.0 mm from a condition with the pair ofexternal electrodes in contact with a solder paste for each ceramicelectronic component.

Whether the ceramic electronic components were cracked or nor wasconfirmed by polishing each ceramic electronic component sealed with theresin, thereby exposing a cross section LT passing through the centralaxis Lc of the laminated body 110, and observing the exposed crosssection with an optical microscope.

In the evaluation of the fixing strength between the ceramic electroniccomponent and the circuit board, twenty pieces were prepared for each ofthe three types of ceramic electronic components, and the ceramicelectronic components were evaluated as bad if there was any ceramicelectronic component with insufficient fixing strength among the twentypieces, or as good if the twenty pieces of laminated ceramic capacitorswere all sufficient in fixing strength.

In the evaluation of the fixing strength between the ceramic electroniccomponent and the circuit board, the ceramic electronic component wasmounted with a solder on a glass epoxy substrate, and a pressing forcewas applied from a side surface of the ceramic electronic component tomeasure the force (fixing strength) required for peeling the ceramicelectronic component from the glass epoxy substrate. Cases with fixingstrength of 5 N or less were determined to be insufficient in fixingstrength.

TABLE 1 Comparative Comparative Example 1 Example 1 Example 2 MaximumLength of  90 μm 110 μm 110 μm Sintered Metal Layer on Principal SurfaceMaximum Length of 110 μm 110 μm  90 μm Sintered Metal Layer on SideSurface Crack Generation Good Bad No good Fixing Strength Good Good Bad

Table 1 summarizes the evaluation results in the experimental examples.As shown in Table 1, the ceramic electronic component according toExample 1 with the maximum lengths La, Lb of the first and secondsintered metal layers 121, 131 made shorter by about 20 μm than themaximum lengths Ld, Le has no crack generation found, and has sufficientfixing strength.

The ceramic electronic component according to Comparative Example 1 withthe maximum length La, Lb of the first and second sintered metal layers121, 131 comparable to the maximum lengths Ld, Le has sufficient fixingstrength, but has a crack found to reach the conductor layer.

The ceramic electronic component according to Comparative Example 2 withthe maximum lengths Ld, Le of the first and second sintered metal layers121, 131 made shorter by 20 μm than the maximum lengths La, Lb has nocrack found to reach any conductor layer, but has crack generationfound, and insufficient fixing strength.

From the experimental results, it has been successfully confirmed thatthe laminated body 110 is prevented from being cracked by making themaximum length La of the first sintered metal layer 121 provided on thesecond principal surface 112 shorter than the maximum length Ld of thefirst sintered metal layer 121 provided on each of the first sidesurface 115 and the second side surface 116, and making the maximumlength Lb of the second sintered metal layer 131 provided on the secondprincipal surface 112 shorter than the maximum length Le of the secondsintered metal layer 131 provided on each of the first side surface 115and the second side surface 116.

In addition, it has been successfully confirmed that the fixing strengthbetween the ceramic electronic component 100 and a circuit board ismaintained by making the area of contact between the first and secondplated layers 123, 133 and a solder larger at the first side surface 115and the second side surface 116 than at the second principal surface112, when the ceramic electronic component 100 is mounted on the circuitboard.

The preferred embodiments disclosed herein should be considered by wayof example in all respects, but not considered restrictive. The scope ofthe present invention is specified by the claims below, but not by theforegoing description, and intended to encompass all changes within thespirit and scope equivalent to the claims.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A ceramic electronic component comprising: alaminated body including a plurality of ceramic layers and a pluralityof conductor layers that are stacked alternately; and first and secondexternal electrodes provided on portions of the laminated body, andelectrically connected to at least some conductor layers of theplurality of conductor layers; wherein the laminated body includes afirst end surface and a second end surface opposing each other in alength direction, a first principal surface and a second principalsurface opposing each other in a height direction, the first and secondprincipal surfaces connecting the first end surface and the second endsurface, and a first side surface and a second side surface opposingeach other in a width direction, the first and second side surfacesconnecting the first principal surface and the second principal surfaceand connecting the first end surface and the second end surface; aheight of the laminated body in the height direction is larger than awidth of the laminated body in the width direction; the first and secondexternal electrodes each includes a sintered metal layer provided on thelaminated body, a conductive resin layer including a mixture of a resinand a metal, the conductive resin layer covering the sintered metallayer, and a plated layer covering the conductive resin layer; the firstexternal electrode extends from the first end surface to at least aportion of the second principal surface, a portion of the first sidesurface, and a portion of the second side surface; the second externalelectrode extends from the second end surface to at least a portion thesecond principal surface, a portion of the first side surface, and aportion of the second side surface; the laminated body includes a firstouter layer portion and a second outer layer portion having a heightthat is greater than a height of the first outer layer portion; thesecond outer layer portion includes an outside outer layer portion andan inside outer layer portion; and a Si content ratio at a boundaryportion between the outside outer layer portion and the inside outerlayer portion is higher than that in a central portion of the outsideouter layer portion.
 2. The ceramic electronic component according toclaim 1, wherein the conductive resin layer contains Cu or Ag.
 3. Theceramic electronic component according to claim 1, wherein theconductive resin layer contains Cu.
 4. The ceramic electronic componentaccording to claim 1, wherein the plated layer includes a Ni platedlayer covering the conductive resin layer, and a Sn plated layercovering the Ni plated layer.
 5. The ceramic electronic componentaccording to claim 1, wherein the maximum length of the sintered metallayer provided on the second principal surface is shorter by about 20 μmor more than the maximum length of the sintered metal layer provided oneach of the first side surface and the second side surface.
 6. Theceramic electronic component according to claim 1, wherein a directionof stacking of the plurality of ceramic layers and the plurality ofconductor layers is one of parallel to the height direction and parallelto the width direction.
 7. The ceramic electronic component according toclaim 1, wherein the width of the laminated body is less than the lengthof the laminated body.
 8. The ceramic electronic component according toclaim 1, wherein the ceramic electronic component is one of a capacitor,a piezoelectric component, a thermistor, and an inductor.
 9. The ceramicelectronic component according to claim 1, wherein a thickness of eachof the plurality of dielectric layers is about 0.5 μm or more and about10 μm or less.
 10. The ceramic electronic component according to claim1, wherein the inside outer layer portion contains less Si than thatincluded in the outside outer layer portion.
 11. The ceramic electroniccomponent according to claim 1, wherein the inside outer layer portionhas a height that is less than a height of the outside outer layerportion.
 12. The ceramic electronic component according to claim 1,wherein the maximum length of the sintered metal layer provided on thesecond principal surface is about 5 μm or more and about 110 μm or less.13. The ceramic electronic component according to claim 1, wherein themaximum length of the sintered metal layer provided on each of the firstside surface and the second side surface is about 25 μm or more andabout 145 μm or less.